The semiconductor etch equipment market refers to the use of the equipment to create patterns on wafers by removing material from thin film. Etching is a technique used in the production of semiconductor devices that removes material from a thin film on a substrate (whether or not the substrate has previously formed a structure on its surface) in a selective manner, leaving behind a pattern of that material on the substrate. The machines are used in the finishing phase of semiconductor manufacturing and are a key part of the process. This prime processing equipment performs 50-60% of the operations, involved in the finishing phase of the product, where wafer surfaces are leveled with two etching operations: dry etch and wet etch.